Etching Capabilities

Dry Etching Capabilities

Deep Reactive Ion Etching (DRIE) in an Oxford PlasmaLab 100 System employing the Bosch process for both 3” and 4” silicon wafer etching.

Reactive Ion Etching (RIE) and sputter etching in a Trion RIE/ICP-RIE with both load-lock and computer control with six mass flow controllers to provide a versatile array of gas compositions.

A Harrick Barrel Plasma System is available for both plasma cleaning, descumming, and etching.

Wet Etching Capabilities

All kinds of Isotropic and Anisotropic Etching is available