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The DWL66fs laser lithography system is an economical, high resolution pattern generator for mask making and direct writing. It is useful in Advanced Packaging, MEMS, Micro-Optics, Semiconductor and other applications that require microstructures. It’s equipped with alignment cameras for front only or front-to-backside alignment and can write a 2 µm line width with a 4 mm write head. The DWL66fs system consists of a Windows 7-based PC for running job files, a Linux-based PC for CAD file conversion, and the main system unit itself. The tool accepts files of various formats, but for best results, the standard GDSII format is recommended. The free CAD editor known as K-Layout can be downloaded and used to convert other file types to GDSII format. After passing the NCF safety exam, users can request training on this machine by sending an email to Those not trained can request an NCF work service order by contacting the NCF Staff.

Location: cleanroom, lithography bay

Trainings: 3 sessions (2 trainings and a checkout session)

Technical Specifications:

  • Available Write head: 4mm
  • Minimum Line Width: 2 µm
  • Mask type: Chrome, Iron Oxide
  • Max Laser Power: 50 mW
  • CAD File types: GDSII (recommended), CIF


One time Reservation Cost: $5

Per Hour Cost: Internal user and External (Academic) user: $10/hr ; External (Industrial or Foreign) : $16/hr

Cleanroom Usage: $34/hr for internal and non-profit, $54.4/hr for external users

User Manual:

The user manual can be found here.

Technical Specifications Heading link

Acceptable mask sizesThicknessAcceptable wafer sizesMinimum Thickness
4 x 4 inches (100 mm X 100 mm)0.6 mm (600 µm)3 inches (75 mm)0.5 mm (500 µm)
5 x 5 inches (125 mm X 125 mm)0.6 mm (600 µm)4 inches (100 mm)0.5 mm (500 µm)
6 x 6 inches (150 mm X 150 mm)0.6 mm (600 µm)Smaller chips must be larger than 30 mm0.5 mm (500 µm)