Packaging Capabilities
- Packaging capabilities
- For most packaging applications, equipment includes a Disco wafer dicing saw with superior 6” wafer and surface video capabilities, a Microautomation 4” wafer dicing saw.
- West Bond ball and a wedge wire bonder.
- Modular Process Technology Rapid Thermal Wafer Processor.
- Parylene coating systems for N type and for C type
- Surface etching and modifications with a Tykma Laser Marking system with computer control software.
- Specialty microscopes include a Keyence VHX6000 with both low and high magnification tube lens systems and adjustable viewing angle.